MCF5216CVM66 vs MCF52110CVM80

This in-depth comparison of the MCF5216CVM66 and MCF52110CVM80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5216CVM66

NXP USA Inc.

Lifecycle
Active
Stock
2628 PCS
Package
BGA-256
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF52110CVM80

NXP USA Inc.

Lifecycle
Active
Stock
9831 PCS
Package
LBGA-81
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5216CVM66 MCF52110CVM80
Supplier - NXP USA Inc.
Series MCF521x MCF521xx
Part Status Not For New Designs Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 80MHz
Connectivity CANbus, EBI/EMI, I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 142 56
Program Memory Size 512KB (512K x 8) 128KB (128K x 8)
Program Memory Type FLASH FLASH
RAM Size 64K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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