MCF52223CAF80 vs MCF5212CAE66R

This in-depth comparison of the MCF52223CAF80 and MCF5212CAE66R provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF52223CAF80

Freescale Semiconductor

Lifecycle
Active
Stock
1539 PCS
Package
LQFP-100
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5212CAE66R

NXP USA Inc.

Lifecycle
Active
Stock
5308 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52223CAF80 MCF5212CAE66R
Supplier - NXP USA Inc.,Flip Electronics
Series MCF5222x MCF521x
Part Status Active Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 66MHz
Connectivity I²C, SPI, UART/USART, USB OTG I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 56 55
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Compare RFQ