MCF52235CAL60 vs MCF5207CAG166

This in-depth comparison of the MCF52235CAL60 and MCF5207CAG166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF52235CAL60

NXP USA Inc.

Lifecycle
Active
Stock
7073 PCS
Package
LQFP-112
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5207CAG166

NXP USA Inc.

Lifecycle
Active
Stock
6650 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52235CAL60 MCF5207CAG166
Supplier - Flip Electronics
Series MCF5223x MCF520x
Part Status Active Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 60MHz 166.67MHz
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART EBI/EMI, I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
Number of I/O 73 30
Program Memory Type FLASH ROMless
RAM Size 32K x 8 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 3.6V
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Program Memory Size 256KB (256K x 8) -
Data Converters A/D 8x12b -
Compare RFQ