MCF52235CAL60 vs MCF5207CAG166

This in-depth comparison of the MCF52235CAL60 and MCF5207CAG166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF52235CAL60

+BOM

7073 PCS | NXP USA Inc.
MCF5207CAG166

+BOM

6650 PCS | NXP USA Inc.
Package LQFP-112 LQFP-144
Description IC MCU 32BIT 256KB FLASH 112LQFP RISC MICROPROCESSOR, 32-BIT, 166
Supplier - Flip Electronics
Series MCF5223x MCF520x
ProductStatus Active Not For New Designs
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 60MHz 166.67MHz
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART EBI/EMI, I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
NumberofI/O 73 30
ProgramMemoryType FLASH ROMless
RAMSize 32K x 8 16K x 8
Voltage-Supply(Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 3.6V
OscillatorType Internal External
OperatingTemperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
ProgramMemorySize 256KB (256K x 8) -
DataConverters A/D 8x12b -
Comparison Model : MCF52235CAL60 MCF5207CAG166

+BOM RFQ