MCF52235CAL60 vs MCF5212CAE66R

This in-depth comparison of the MCF52235CAL60 and MCF5212CAE66R provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MCF52235CAL60

NXP USA Inc.

Lifecycle
Active
Stock
7073 PCS
Package
LQFP-112
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5212CAE66R

NXP USA Inc.

Lifecycle
Active
Stock
5308 PCS
Package
LQFP-64
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52235CAL60 MCF5212CAE66R
Supplier - NXP USA Inc.,Flip Electronics
Series MCF5223x MCF521x
Part Status Active Not For New Designs
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 60MHz 66MHz
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 73 55
Program Memory Size 256KB (256K x 8) 256KB (256K x 8)
Program Memory Type FLASH FLASH
RAM Size 32K x 8 32K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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