MCF52235CAL60 vs MCF52232AF50

This in-depth comparison of the MCF52235CAL60 and MCF52232AF50 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF52235CAL60

+BOM

7073 PCS | NXP USA Inc.
MCF52232AF50

+BOM

891 PCS | NXP USA Inc.
Package LQFP-112 LQFP-80
Description IC MCU 32BIT 256KB FLASH 112LQFP IC MCU 32BIT 128KB FLASH 80LQFP
Supplier - Flip Electronics,NXP USA Inc.
Series MCF5223x MCF5223x
ProductStatus Active Active
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 60MHz 50MHz
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART Ethernet, I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
NumberofI/O 73 56
ProgramMemorySize 256KB (256K x 8) 128KB (128K x 8)
ProgramMemoryType FLASH FLASH
RAMSize 32K x 8 32K x 8
Voltage-Supply(Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
DataConverters A/D 8x12b A/D 8x12b
OscillatorType Internal Internal
OperatingTemperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
MountingType Surface Mount Surface Mount
Comparison Model : MCF52235CAL60 MCF52232AF50

+BOM RFQ