MCF52255CAF80 vs MCF5235CVM100

This in-depth comparison of the MCF52255CAF80 and MCF5235CVM100 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MCF52255CAF80

NXP USA Inc.

Lifecycle
Active
Stock
6849 PCS
Package
SOT407-3
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5235CVM100

Motorola

Lifecycle
Active
Stock
6128 PCS
Package
LBGA-256
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52255CAF80 MCF5235CVM100
Supplier - Rochester Electronics, LLC
Series MCF5225x MCF523x
Part Status Active Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 100MHz
Connectivity CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG CANbus, EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
Number of I/O 56 113
Program Memory Type FLASH ROMless
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 1.6V
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Program Memory Size 512KB (512K x 8) -
Data Converters A/D 8x12b -
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