MCF52255CAF80 vs MCF5249LAG120

This in-depth comparison of the MCF52255CAF80 and MCF5249LAG120 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MCF52255CAF80

NXP USA Inc.

Lifecycle
Active
Stock
6849 PCS
Package
SOT407-3
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5249LAG120

Freescale Semiconductor

Lifecycle
Active
Stock
6326 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52255CAF80 MCF5249LAG120
Supplier - Rochester Electronics, LLC
Series MCF5225x MCF524x
Part Status Active Active
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 120MHz
Connectivity CANbus, Ethernet, I²C, QSPI, UART/USART, USB OTG I²C, IDE, Memory Card, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, I²S, POR, Serial Audio, WDT
Number of I/O 56 34
Program Memory Type FLASH ROMless
RAM Size 64K x 8 96K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 4x12b
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
Program Memory Size 512KB (512K x 8) -
Compare RFQ