MCF5235CVM150 vs MCF52258VN80

This in-depth comparison of the MCF5235CVM150 and MCF52258VN80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5235CVM150

NXP USA Inc.

Lifecycle
Active
Stock
6717 PCS
Package
BGA-256
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCF52258VN80

NXP USA Inc.

Lifecycle
Active
Stock
4749 PCS
Package
LBGA-144
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5235CVM150 MCF52258VN80
Supplier - Rochester Electronics, LLC,NXP USA Inc.
Series - MCF5225x
Part Status Active Active
Core Processor - Coldfire V2
Core Size - 32-Bit Single-Core
Speed - 80MHz
Connectivity - CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals - DMA, LVD, POR, PWM, WDT
Number of I/O - 96
Program Memory Size - 512KB (512K x 8)
Program Memory Type - FLASH
RAM Size - 64K x 8
Voltage - Supply (Vcc/Vdd) - 3V ~ 3.6V
Data Converters - A/D 8x12b
Oscillator Type - Internal
Operating Temperature - 0°C ~ 70°C (TA)
Mounting Type - Surface Mount
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