MCF5235CVM150 vs MCF5272CVF66

This in-depth comparison of the MCF5235CVM150 and MCF5272CVF66 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5235CVM150

NXP USA Inc.

Lifecycle
Active
Stock
6717 PCS
Package
BGA-256
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCF5272CVF66

NXP USA Inc.

Lifecycle
Active
Stock
4399 PCS
Package
LBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5235CVM150 MCF5272CVF66
Supplier - NXP USA Inc.
Series - MCF527x
Part Status Active Obsolete
Core Processor - Coldfire V2
Core Size - 32-Bit Single-Core
Speed - 66MHz
Connectivity - EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals - DMA, WDT
Number of I/O - 32
Program Memory Size - 16KB (4K x 32)
Program Memory Type - ROM
RAM Size - 1K x 32
Voltage - Supply (Vcc/Vdd) - 3V ~ 3.6V
Oscillator Type - External
Operating Temperature - -40°C ~ 85°C (TA)
Mounting Type - Surface Mount
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