MCF5272CVM66R2 vs MCF5208CVM166J

This in-depth comparison of the MCF5272CVM66R2 and MCF5208CVM166J provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5272CVM66R2

NXP USA Inc.

Lifecycle
Active
Stock
5783 PCS
Package
LBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5208CVM166J

NXP USA Inc.

Lifecycle
Active
Stock
9431 PCS
Package
LBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5272CVM66R2 MCF5208CVM166J
Supplier - NXP USA Inc.
Series MCF527x MCF520x
Part Status Obsolete Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 166.67MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, WDT
Number of I/O 32 50
Program Memory Type ROM ROMless
RAM Size 1K x 32 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 3.6V
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Program Memory Size 16KB (4K x 32) -
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