MCF5272CVM66R2 vs MCF5211LCVM80

This in-depth comparison of the MCF5272CVM66R2 and MCF5211LCVM80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5272CVM66R2

NXP USA Inc.

Lifecycle
Active
Stock
5783 PCS
Package
LBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5211LCVM80

NXP USA Inc.

Lifecycle
Active
Stock
2866 PCS
Package
LBGA-81
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5272CVM66R2 MCF5211LCVM80
Supplier - NXP USA Inc.
Series MCF527x MCF521x
Part Status Obsolete Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 80MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB CANbus, I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 32 56
Program Memory Size 16KB (4K x 32) 128KB (128K x 8)
Program Memory Type ROM FLASH
RAM Size 1K x 32 16K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters - A/D 8x12b
Oscillator Type External External
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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