MCIMX537CVV8C vs MCIMX287CVM4B

This in-depth comparison of the MCIMX537CVV8C and MCIMX287CVM4B provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX537CVV8C

NXP USA Inc.

Lifecycle
Active
Stock
1540 PCS
Package
SOT1717-1
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX287CVM4B

NXP USA Inc.

Lifecycle
Active
Stock
1265 PCS
Package
SOT1534-1
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX537CVV8C MCIMX287CVM4B
Series i.MX53 i.MX28
Part Status Obsolete Active
Core Processor ARM® Cortex®-A8 ARM926EJ-S
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 800MHz 454MHz
Co - Processors / DSP Multimedia; NEON™ SIMD Data; DCP
RAM Controllers LPDDR2, DDR2, DDR3 LVDDR, LVDDR2, DDR2
Graphics Acceleration Yes No
Display&Interface Controllers Keypad, LCD Keypad, LCD, Touchscreen
Ethernet 10/100Mbps (1) 10/100Mbps (1)
SATA SATA 1.5Gbps (1) -
USB USB 2.0 (2), USB 2.0 + PHY (2) USB 2.0 + PHY (2)
Voltage - I / O 1.3V, 1.8V, 2.775V, 3.3V 1.8V, 3.3V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Boot Security, Cryptography, Hardware ID
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