MCIMX537CVV8C vs MCIMX6G1CVM05AB

This in-depth comparison of the MCIMX537CVV8C and MCIMX6G1CVM05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX537CVV8C

NXP USA Inc.

Lifecycle
Active
Stock
1540 PCS
Package
SOT1717-1
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX6G1CVM05AB

NXP USA Inc.

Lifecycle
Active
Stock
6745 PCS
Package
SOT1534-2
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX537CVV8C MCIMX6G1CVM05AB
Series i.MX53 i.MX6UL
Part Status Obsolete Active
Core Processor ARM® Cortex®-A8 ARM® Cortex®-A7
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 800MHz 528MHz
Co - Processors / DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR2, DDR3 LPDDR2, DDR3, DDR3L
Graphics Acceleration Yes No
Display&Interface Controllers Keypad, LCD LVDS
Ethernet 10/100Mbps (1) 10/100Mbps (1)
SATA SATA 1.5Gbps (1) -
USB USB 2.0 (2), USB 2.0 + PHY (2) USB 2.0 + PHY (2)
Voltage - I / O 1.3V, 1.8V, 2.775V, 3.3V 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 105°C (TJ)
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
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