MCIMX287CVM4B vs MCIMX6D5EYM10ADR

This in-depth comparison of the MCIMX287CVM4B and MCIMX6D5EYM10ADR provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX287CVM4B

NXP USA Inc.

Lifecycle
Active
Stock
1265 PCS
Package
SOT1534-1
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MCIMX6D5EYM10ADR

NXP USA Inc.

Lifecycle
Active
Stock
5667 PCS
Package
SOT1642-1
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX287CVM4B MCIMX6D5EYM10ADR
Series i.MX28 i.MX6D
Part Status Active Active
Core Processor ARM926EJ-S ARM® Cortex®-A9
Number of Cores / Bus Width 1 Core, 32-Bit 2 Core, 32-Bit
Speed 454MHz 1.0GHz
Co - Processors / DSP Data; DCP Multimedia; NEON™ SIMD
RAM Controllers LVDDR, LVDDR2, DDR2 LPDDR2, LVDDR3, DDR3
Graphics Acceleration No Yes
Display&Interface Controllers Keypad, LCD, Touchscreen Keypad, LCD
Ethernet 10/100Mbps (1) 10/100/1000Mbps (1)
SATA - SATA 3Gbps (1)
USB USB 2.0 + PHY (2) USB 2.0 + PHY (4)
Voltage - I / O 1.8V, 3.3V 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature -40°C ~ 85°C (TA) -20°C ~ 105°C (TJ)
Security Features Boot Security, Cryptography, Hardware ID ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
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