MCIMX6G3CVM05AB vs MCIMX515DJM8C

This in-depth comparison of the MCIMX6G3CVM05AB and MCIMX515DJM8C provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX6G3CVM05AB

NXP USA Inc.

Lifecycle
Active
Stock
1627 PCS
Package
LFBGA-289
Series
Embedded - Microprocessors
Part B

MCIMX515DJM8C

NXP Semiconductors

Lifecycle
Active
Stock
3546 PCS
Package
LFBGA-529
Series
Embedded - Microprocessors

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCIMX6G3CVM05AB MCIMX515DJM8C
Series i.MX6UL -
Part Status Active Obsolete
Core Processor ARM® Cortex®-A7 ARM® Cortex®-A8
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 528MHz 800MHz
Co - Processors / DSP Multimedia; NEON™ SIMD Multimedia; NEON™ SIMD
RAM Controllers LPDDR2, DDR3, DDR3L DDR2, LPDDR2
Graphics Acceleration No Yes
Display&Interface Controllers LCD, LVDS Keypad, LCD
Ethernet 10/100Mbps (2) 10/100Mbps (1)
USB USB 2.0 + PHY (2) USB 2.0 (3), USB 2.0 + PHY (1)
Voltage - I / O 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V 1.2V, 1.875V, 2.775V, 3V
Operating Temperature -40°C ~ 105°C (TJ) -20°C ~ 85°C (TC)
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC