MCIMX6Z0DVM09AB vs MCIMX6G2CVK05AB

This in-depth comparison of the MCIMX6Z0DVM09AB and MCIMX6G2CVK05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCIMX6Z0DVM09AB

NXP USA Inc.

Lifecycle: Active
Stock: 5758 PCS
Package: LFBGA-289
Series: Embedded - Microprocessors

+BOM RFQ

Part B

MCIMX6G2CVK05AB

NXP USA Inc.

Lifecycle: Active
Stock: 5450 PCS
Package: LFBGA-272
Series: Embedded - Microprocessors

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MCIMX6Z0DVM09AB	MCIMX6G2CVK05AB
Series	i.MX6	i.MX6UL
Part Status	Active	Active
Core Processor	ARM® Cortex®-A7	ARM® Cortex®-A7
Number of Cores / Bus Width	1 Core, 32-Bit	1 Core, 32-Bit
Speed	900MHz	528MHz
Co - Processors / DSP	Multimedia; NEON™ SIMD	Multimedia; NEON™ SIMD
RAM Controllers	LPDDR2, DDR3, DDR3L	LPDDR2, DDR3, DDR3L
Graphics Acceleration	No	No
Display&Interface Controllers	Keypad	LCD, LVDS
Ethernet	-	10/100Mbps (2)
USB	USB 2.0 OTG + PHY (2)	USB 2.0 + PHY (2)
Voltage - I / O	-	1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature	0°C ~ 95°C (TJ)	-40°C ~ 105°C (TJ)
Security Features	A-HAB, ARM TZ, CSU, SJC, SNVS	ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS

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