MCP23S17T-E/ML vs MCP23S17-E/ML

This in-depth comparison of the MCP23S17-E/ML and MCP23S17T-E/ML provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCP23S17-E/ML

+BOM

3181 PCS | Microchip Technology
MCP23S17T-E/ML

+BOM

4961 PCS | Microchip Technology
Package QFN-28 QFN-28
Description IC I/O EXPANDER SPI 16B 28QFN IC I/O EXPANDER SPI 16B 28QFN
ProductStatus Active Active
NumberofI/O 16 16
Interface SPI SPI
InterruptOutput Yes Yes
Features POR POR
OutputType Push-Pull Push-Pull
Current-OutputSource/Sink 25mA 25mA
ClockFrequency 10 MHz 10 MHz
Voltage-Supply 1.8V ~ 5.5V 1.8V ~ 5.5V
OperatingTemperature -40°C ~ 125°C -40°C ~ 125°C
MountingType Surface Mount Surface Mount
Comparison Model : MCP23S17-E/ML MCP23S17T-E/ML

+BOM RFQ