MPC7410RX500LE vs MPC7410THX400LE

This in-depth comparison of the MPC7410RX500LE and MPC7410THX400LE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MPC7410RX500LE

NXP USA Inc.

Lifecycle
Active
Stock
2020 PCS
Package
FCCBGA
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC7410THX400LE

NXP USA Inc.

Lifecycle
Active
Stock
8398 PCS
Package
BCBGA-360
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC7410RX500LE MPC7410THX400LE
Supplier - NXP USA Inc.
Series MPC74xx MPC74xx
Part Status Obsolete Obsolete
Core Processor PowerPC G4 PowerPC G4
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 500MHz 400MHz
Graphics Acceleration No No
Voltage - I / O 1.8V, 2.5V, 3.3V 1.8V, 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA) -40°C ~ 105°C (TA)
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