MPC7410RX500LE vs MPC745CVT350LE

This in-depth comparison of the MPC7410RX500LE and MPC745CVT350LE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MPC7410RX500LE

NXP USA Inc.

Lifecycle
Active
Stock
2020 PCS
Package
FCCBGA
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC745CVT350LE

NXP USA Inc.

Lifecycle
Active
Stock
3442 PCS
Package
BBGA-255
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC7410RX500LE MPC745CVT350LE
Supplier - NXP USA Inc.
Series MPC74xx MPC7xx
Part Status Obsolete Obsolete
Core Processor PowerPC G4 PowerPC
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 500MHz 350MHz
Graphics Acceleration No No
Voltage - I / O 1.8V, 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature 0°C ~ 105°C (TA) 0°C ~ 105°C (TA)
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