MPC7410THX500LE vs MPC745BPX300LE Comparison

This in-depth comparison of the MPC7410THX500LE and MPC745BPX300LE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC7410THX500LE

+BOM

3100 PCS | NXP USA Inc.
MPC745BPX300LE

+BOM

2121 PCS | NXP USA Inc.
Package SOT1603-6 BBGA-255
Description IC MPU MPC74XX 500MHZ 360FCCBGA IC MPU MPC7XX 300MHZ 255FCBGA
Supplier - NXP USA Inc.
Series MPC74xx MPC7xx
Part Status Obsolete Obsolete
Core Processor PowerPC G4 PowerPC
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 500MHz 300MHz
Graphics Acceleration No No
Voltage - I / O 1.8V, 2.5V, 3.3V 2.5V, 3.3V
Operating Temperature -40°C ~ 105°C (TA) 0°C ~ 105°C (TA)
Comparison Model : MPC7410THX500LE MPC745BPX300LE

+BOM RFQ