MPC8560VT833LC vs MPC8555EVTAPF

This in-depth comparison of the MPC8555EVTAPF and MPC8560VT833LC provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC8555EVTAPF

+BOM

7935 PCS | NXP USA Inc.
MPC8560VT833LC

+BOM

2911 PCS | NXP USA Inc.
Package 783-BBGA, FCBGA 784-BBGA
Description IC MPU MPC85XX 833MHZ 783FCBGA IC MPU MPC85XX 833MHZ 783FCBGA
Supplier Flip Electronics,NXP USA Inc. -
Series MPC85xx MPC85xx
ProductStatus Obsolete Obsolete
CoreProcessor PowerPC e500 PowerPC e500
NumberofCores/BusWidth 1 Core, 32-Bit 1 Core, 32-Bit
Speed 833MHz 833MHz
Co-Processors/DSP Communications; CPM, Security; SEC Communications; CPM
RAMControllers DDR, SDRAM DDR, SDRAM
GraphicsAcceleration No No
Ethernet 10/100/1000Mbps (2) 10/100/1000Mbps (2)
USB USB 2.0 (1) -
Voltage-I/O 2.5V, 3.3V 2.5V, 3.3V
OperatingTemperature 0°C ~ 105°C (TA) 0°C ~ 105°C (TA)
SecurityFeatures Cryptography, Random Number Generator -
Comparison Model : MPC8555EVTAPF MPC8560VT833LC

+BOM RFQ