MPC860PVR80D4 vs MPC860DTCVR66D4

This in-depth comparison of the MPC860PVR80D4 and MPC860DTCVR66D4 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC860PVR80D4

NXP USA Inc.

Lifecycle
Active
Stock
4232 PCS
Package
BGA-357
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC860DTCVR66D4

NXP USA Inc.

Lifecycle
Active
Stock
7648 PCS
Package
BBGA-357
Series
Embedded - Microprocessors
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC860PVR80D4 MPC860DTCVR66D4
Supplier - Flip Electronics,NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 80MHz 66MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (4), 10/100Mbps (1) 10Mbps (2), 10/100Mbps (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) -40°C ~ 95°C (TA)
Compare RFQ