MPC860TVR50D4 vs MPC862PVR80B

This in-depth comparison of the MPC860TVR50D4 and MPC862PVR80B provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC860TVR50D4

NXP USA Inc.

Lifecycle
Active
Stock
2566 PCS
Package
BGA-357
Series
Embedded - Microprocessors
+BOM RFQ
Part B

MPC862PVR80B

NXP USA Inc.

Lifecycle
Active
Stock
8116 PCS
Package
BBGA-357
Series
Embedded - Microprocessors
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC860TVR50D4 MPC862PVR80B
Supplier - NXP USA Inc.
Series MPC8xx MPC8xx
Part Status Obsolete Obsolete
Core Processor MPC8xx MPC8xx
Number of Cores / Bus Width 1 Core, 32-Bit 1 Core, 32-Bit
Speed 50MHz 80MHz
Co - Processors / DSP Communications; CPM Communications; CPM
RAM Controllers DRAM DRAM
Graphics Acceleration No No
Ethernet 10Mbps (4), 10/100Mbps (1) 10Mbps (4), 10/100Mbps (1)
Voltage - I / O 3.3V 3.3V
Operating Temperature 0°C ~ 95°C (TA) 0°C ~ 105°C (TA)
Compare RFQ