XC3S400A-4FGG400C vs XC3S400A-4FTG256I

This in-depth comparison of the XC3S400A-4FGG400C and XC3S400A-4FTG256I provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

XC3S400A-4FGG400C

AMD Xilinx

Lifecycle
Active
Stock
5442 PCS
Package
FBGA-400
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ
Part B

XC3S400A-4FTG256I

AMD Xilinx

Lifecycle
Active
Stock
1829 PCS
Package
FBGA-256
Series
Embedded - FPGAs (Field Programmable Gate Array)
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification XC3S400A-4FGG400C XC3S400A-4FTG256I
Series Spartan®-3A Spartan®-3A
Part Status Active Active
Number of LABs/CLBs 896 896
Number of Logic Elements/Cells 8064 8064
Total RAM Bits 368640 368640
Number of I/O 311 195
Number of Gates 400000 400000
Voltage - Supply 1.14V ~ 1.26V 1.14V ~ 1.26V
Mounting Type Surface Mount Surface Mount
Operating Temperature 0°C ~ 85°C (TJ) -40°C ~ 100°C (TJ)
Compare RFQ