Specifications
| Attribute | Value |
| Package | Tray |
| Series | Spartan®-3A |
| ProductStatus | Active |
| NumberofLABs/CLBs | 896 |
| NumberofLogicElements/Cells | 8064 |
| TotalRAMBits | 368640 |
| NumberofI/O | 311 |
| NumberofGates | 400000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 400-BGA |
Overview
Description
The XC3S400A-4FGG400C is a Spartan-3A FPGA from Xilinx, featuring 400,000 system gates, 8064 logic cells, and 288 KB block RAM. It operates at a speed grade of -4, indicating moderate performance. The FGG400 package (400-pin Fine-Pitch Ball Grid Array) offers 320 user I/O pins, supporting various standards like LVCMOS, LVTTL, and differential signaling (LVDS).
Key features include:
- On-chip DSP blocks for arithmetic operations.
- Digital Clock Management (DCM) for clock synchronization.
- Low-power 90nm process technology.
- Embedded multipliers (16x16-bit).
Ideal for cost-sensitive, low-to-mid complexity designs (e.g., industrial control, consumer electronics). The -4 speed grade balances performance and power efficiency.
For more details, refer to Xilinx DS529 (Spartan-3A datasheet).
Key features include:
- On-chip DSP blocks for arithmetic operations.
- Digital Clock Management (DCM) for clock synchronization.
- Low-power 90nm process technology.
- Embedded multipliers (16x16-bit).
Ideal for cost-sensitive, low-to-mid complexity designs (e.g., industrial control, consumer electronics). The -4 speed grade balances performance and power efficiency.
For more details, refer to Xilinx DS529 (Spartan-3A datasheet).
Equivalent
The XC3S400A-4FGG400C is a Spartan-3A FPGA. Equivalent alternatives include:
1. XC3S400A-4FGG400I (Industrial temp range)
2. XC3S400A-4FG320C (Smaller package, same specs)
3. Lattice ECP3 or Microsemi ProASIC3 (Competing FPGAs with similar logic capacity)
4. Xilinx Spartan-6 LX9 (Newer, but may require migration).
Check pin compatibility and features before substitution.
1. XC3S400A-4FGG400I (Industrial temp range)
2. XC3S400A-4FG320C (Smaller package, same specs)
3. Lattice ECP3 or Microsemi ProASIC3 (Competing FPGAs with similar logic capacity)
4. Xilinx Spartan-6 LX9 (Newer, but may require migration).
Check pin compatibility and features before substitution.
Features
The XC3S400A-4FGG400C is a Spartan-3A FPGA from Xilinx with these key features:
- Logic Cells: 400K (equivalent to ~8,640 logic slices)
- Block RAM: 288 Kb (16 x 18 Kb blocks)
- DSP Slices: 16 (18x18 multipliers)
- User I/Os: 311 (supports LVCMOS, LVTTL, HSTL, SSTL)
- Speed Grade: -4 (moderate performance)
- Package: 400-pin Fine-Pitch BGA (FGG400)
- Max Frequency: ~300 MHz (varies by design)
- Configuration: Supports SPI flash, BPI, and JTAG
- Power: 1.2V core voltage, 3.3V/2.5V I/O banks
- Features: Integrated DCM (clock management), power-saving modes
Ideal for cost-sensitive, low-to-mid complexity designs.
- Logic Cells: 400K (equivalent to ~8,640 logic slices)
- Block RAM: 288 Kb (16 x 18 Kb blocks)
- DSP Slices: 16 (18x18 multipliers)
- User I/Os: 311 (supports LVCMOS, LVTTL, HSTL, SSTL)
- Speed Grade: -4 (moderate performance)
- Package: 400-pin Fine-Pitch BGA (FGG400)
- Max Frequency: ~300 MHz (varies by design)
- Configuration: Supports SPI flash, BPI, and JTAG
- Power: 1.2V core voltage, 3.3V/2.5V I/O banks
- Features: Integrated DCM (clock management), power-saving modes
Ideal for cost-sensitive, low-to-mid complexity designs.
Pinout
The XC3S400A-4FGG400C is a Spartan-3A FPGA from Xilinx with the following key details:
- Pin Count: 400 (FGG400 package, Fine-Pitch Ball Grid Array).
- Functions:
- User I/O Pins: 311 (configurable as LVCMOS, LVTTL, or other standards).
- Power/Ground Pins: For core (1.2V) and I/O (3.3V/2.5V/1.8V) supply.
- Clock Pins: Dedicated global and regional clock inputs.
- JTAG Pins: For configuration and debugging (TDI, TDO, TMS, TCK).
- Configuration Pins: (DIN, DOUT, CCLK, PROG_B, etc.) for flash/SPI loading.
It features 400K system gates, 8064 logic cells, and supports various I/O standards.
- Pin Count: 400 (FGG400 package, Fine-Pitch Ball Grid Array).
- Functions:
- User I/O Pins: 311 (configurable as LVCMOS, LVTTL, or other standards).
- Power/Ground Pins: For core (1.2V) and I/O (3.3V/2.5V/1.8V) supply.
- Clock Pins: Dedicated global and regional clock inputs.
- JTAG Pins: For configuration and debugging (TDI, TDO, TMS, TCK).
- Configuration Pins: (DIN, DOUT, CCLK, PROG_B, etc.) for flash/SPI loading.
It features 400K system gates, 8064 logic cells, and supports various I/O standards.
Application
The XC3S400A-4FGG400C, a Spartan-3A FPGA, is used in:
1. Embedded Systems – Control and interface applications.
2. Communication – Signal processing, networking, and protocol bridging.
3. Industrial Automation – Motor control, sensor interfacing, and PLCs.
4. Consumer Electronics – Display controllers and multimedia devices.
5. Military/Aerospace – Ruggedized and radiation-tolerant designs.
6. Prototyping & Education – Low-cost FPGA development.
Its 400K system gates, 400MHz speed, and 400-pin BGA package make it suitable for cost-sensitive, mid-complexity designs.
1. Embedded Systems – Control and interface applications.
2. Communication – Signal processing, networking, and protocol bridging.
3. Industrial Automation – Motor control, sensor interfacing, and PLCs.
4. Consumer Electronics – Display controllers and multimedia devices.
5. Military/Aerospace – Ruggedized and radiation-tolerant designs.
6. Prototyping & Education – Low-cost FPGA development.
Its 400K system gates, 400MHz speed, and 400-pin BGA package make it suitable for cost-sensitive, mid-complexity designs.
Package
The XC3S400A-4FGG400C is a Spartan-3A FPGA from Xilinx. It comes in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package (FGG400). The "4" denotes a speed grade of -4, indicating performance characteristics. The package is lead-free (RoHS compliant) and designed for surface-mount assembly.
