MTFC256GBEAXHF-WT

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MTFC256GBEAXHF-WT

+BOM

IC FLASH 2TBIT UFS 153VFBGA

  • ManufacturerMicron Technology Inc.

  • Mfr. Part #MTFC256GBEAXHF-WT

  • In Stock19431

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Specifications

Attribute Value
PartStatus Obsolete
BaseProductNumber MTFC256
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NAND (SLC)
MemorySize 2Tbit
MemoryOrganization 256G x 8
MemoryInterface UFS 4.0
OperatingTemperature -25°C ~ 85°C
MountingType Surface Mount
Package 153-WFBGA
SupplierDevicePackage 153-WFBGA (11x13)
Packaging Tray

Overview

Description

MTFC256GBEAXHF-WT appears to be a model/part number for a 256 GB flash storage device. The exact specs (interface, form factor, controller, NAND type, endurance, and features) depend on the vendor and datasheet behind the part. Typically, such a model denotes NAND-flash-based storage with a controller, ECC, wear leveling, and firmware suited for embedded or consumer storage. The “-WT” suffix likely encodes packaging, temperature rating, or regional variant.
To give a precise introduction, please share the vendor or a datasheet/link. I can then summarize the key specifications, performance characteristics, interfaces (e.g., SATA/PCIe/eMMC/UFS), and typical applications.

Pinout

- Pin count: Depends on the package variant; MTFC devices are high-pin-count BGA parts (exact count varies by package). Please refer to the specific datasheet for MTFC256GBEAXHF-WT to confirm.
- Function: 256 GB embedded flash storage (non-volatile memory) with an onboard controller and host interface (typical eMMC/UFS-style interface for embedded storage).

Manufacturer

Manufacturer: Micron Technology, Inc. It is an American multinational company that designs and manufactures memory and storage technologies (DRAM, NAND flash, NOR flash, SSDs, etc.).

Application

MTFC256GBEAXHF-WT is a 256 GB embedded NAND flash device (typically used as eMMC/UFS storage). Common application areas include:
- Embedded systems and consumer electronics
- Automotive infotainment and ADAS
- Industrial IoT and automation controllers
- Surveillance cameras and video recorders
- Drones, robotics and edge AI devices
- Mobile devices, tablets and thin clients
- Storage appliances and media caching
- Portable medical devices with local storage
Note: exact use may depend on form factor, interface (eMMC/UFS), and operating temperature range.

Package

FBGA (Fine-pitched Ball Grid Array) package.

Frequently Asked Questions


Q: What is the memory capacity and organization of the MTFC256GBEAXHF-WT?
A: This device offers 2Tbit (256GB) Non-Volatile FLASH memory, organized as 256G x 8 bits for high-density data storage.


Q: What type of NAND flash technology does this component use?
A: It uses FLASH - NAND (SLC) technology, providing high endurance and reliability for industrial applications.


Q: Which memory interface does this UFS device support?
A: The memory interface is UFS 4.0, enabling high-speed data transfer rates for advanced embedded systems.


Q: What is the operating temperature range for this component?
A: The operating temperature range is -25°C to 85°C, suitable for demanding environments.


Q: What is the package type and size of the MTFC256GBEAXHF-WT?
A: It comes in a 153-WFBGA surface mount package, with a supplier device package size of 11x13mm.


Q: Is this product currently in production or discontinued?
A: The part status is marked as 'Obsolete', meaning it is no longer in active production.


Q: What is the packaging format for this memory component?
A: The device is supplied in a Tray packaging, suitable for automated assembly processes.


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