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NT5CC256M16ER-EK
+BOM1.35V 4Gbit 933MHz DDR3L SDRAM TFBGA-96 Memory (ICs) RoHS
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ManufacturerNanya Tech
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Mfr. Part #NT5CC256M16ER-EK
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Datasheet NT5CC256M16ER-EK DataSheet
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In Stock27728
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Specifications
| Attribute | Value |
| Packaging | TFBGA-96 |
| Clock Frequency | 933MHz |
| Memory Format | DDR3L SDRAM |
| Memory Size | 4Gbit |
| Operating temperature | 0℃~+95℃ |
| Voltage - Supply | 1.35V |
Overview
Description
Key features of the NT5CC256M16ER-EK include:
1. Memory Capacity: It typically offers a capacity of 4Gb, organized in a 256M x 16-bit configuration.
2. Speed and Performance: Operates with a high-speed data transfer rate up to 1866 MT/s (million transfers per second), allowing for efficient handling of data-intensive tasks.
3. Voltage: It operates at a standard voltage of 1.35V or 1.5V, making it suitable for energy-efficient applications.
4. Package: Comes in a compact FBGA (Fine-pitch Ball Grid Array) package, which helps in saving space on circuit boards while maintaining reliability.
This DRAM is utilized where large memory bandwidth and reliability are crucial, such as in graphic applications, enterprise systems, and other demanding computing environments.
Equivalent
1. Micron MT41K256M16TW-107:P
2. Samsung K4B4G1646E-BYK0
3. SK Hynix H5TQ4G63AFR-PBC
These alternatives have similar configurations in terms of memory size, speed, and voltage. Always verify compatibility with your specific system requirements.
Features
1. Capacity: It provides a storage capacity of 4 Gb organized as 256M x 16 bits.
2. Speed: Supports data rates of up to 1866 Mbps, making it suitable for high-performance applications.
3. Voltage: Operates at a low voltage of 1.35V (DDR3L), with backward compatibility to 1.5V (DDR3).
4. Package: Comes in an FBGA (Fine-pitch Ball Grid Array) package, which aids in efficient heat dissipation and compact design.
5. Temperature Range: Designed to operate in standard commercial temperature ranges, typically from 0°C to 95°C.
6. Compatibility: Conforms to the JEDEC standard for DDR3 DRAM, ensuring compatibility with a wide range of systems and devices.
7. Reliability: Includes features like on-die termination (ODT) and self-refresh for enhanced signal integrity and reduced power consumption.
8. Applications: Ideal for use in desktops, laptops, and other consumer electronics requiring high-speed data processing and low power consumption.
These features make it a versatile component for modern computing needs.
Pinout
The primary function of this chip is to serve as a volatile memory component in electronic devices, offering temporary data storage to facilitate quick read and write operations necessary for system performance. As a DDR3L memory, it operates at a lower voltage compared to standard DDR3, which helps in power-efficient applications. This makes it suitable for laptops, desktops, and other devices requiring efficient memory performance.
It supports features like high-speed data transfer rates starting from 800 MT/s (megatransfers per second) to up to 1600 MT/s, on-die termination, and data masking for efficient signal integrity and energy efficiency. It is designed to be compatible with the DDR3 interface specifications, ensuring broad compatibility with a wide range of computing devices and systems.
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Frequently Asked Questions
Q: What is the memory density and organization of the NT5CC256M16ER-EK?
A: It is a 4Gbit DDR3L SDRAM organized as 256M words x 16 bits, suitable for high-bandwidth applications.
Q: What is the operating voltage range for this component?
A: It requires a standard DDR3L supply voltage of 1.35V, supporting low-power operation.
Q: What clock frequency does this memory support?
A: It supports a clock frequency of 933MHz, corresponding to DDR3L-1866 data rate for high-speed performance.
Q: What is the operating temperature range for this IC?
A: It operates within a commercial temperature range of 0°C to +95°C (Tcase), suitable for most embedded systems.
Q: What package type is the NT5CC256M16ER-EK offered in?
A: It comes in a TFBGA-96 package, which is a fine-pitch ball grid array for compact PCB designs.
Q: Can this memory be used in battery-powered devices?
A: Yes, as a 1.35V DDR3L device, it consumes less power than standard 1.5V DDR3, ideal for portable applications.