2N7002NXAKR vs 2N7002E-T1-E3

This in-depth comparison of the 2N7002NXAKR and 2N7002E-T1-E3 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 2N7002NXAKR and 2N7002E-T1-E3 are both N-channel enhancement-mode MOSFETs in SOT-23 packages with comparable voltage and current ratings, making them viable functional substitutes in most low-power switching applications. Designers should verify gate threshold and RDS(on) tolerances against their specific drive conditions before committing to a drop-in replacement.

Drain-Source Voltage Rating High match
Continuous Drain Current High match
Package Type High match
On-Resistance Validation required

Parts at a glance

Part A

2N7002NXAKR

Nexperia USA Inc.

Lifecycle
Active
Stock
2910 PCS
Package
SOT-23-3
Series
Transistors - FETs, MOSFETs - Single
Part B

2N7002E-T1-E3

Vishay Siliconix

Lifecycle
Active
Stock
7566 PCS
Package
SOT-23-3
Series
Transistors - FETs, MOSFETs - Single

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 2N7002NXAKR 2N7002E-T1-E3 Why it matters
Drain-Source Voltage (Vds) 60 V 60 V Maximum voltage the device can block; must meet or exceed circuit rail voltage for safe operation.
Continuous Drain Current (Id) 300 mA 300 mA Defines the maximum continuous load current the MOSFET can carry without exceeding thermal limits.
Drain-Source On-Resistance (Rds(on)) 1.6 Ω @ Vgs=10V, Id=500mA 1.6 Ω @ Vgs=10V, Id=500mA Lower on-resistance reduces conduction losses and heat generation in switching and load-driving applications.
Gate Threshold Voltage (Vgs(th)) 1.0 V to 2.5 V 1.0 V to 2.5 V Determines the minimum gate voltage needed to turn the device on; critical for compatibility with logic-level drive circuits.
Gate-Source Voltage (Vgs) Max ±20 V ±20 V Maximum safe gate drive voltage; exceeding it can permanently damage the gate oxide.
Power Dissipation (Pd) 420 mW 420 mW Maximum power the package can dissipate; limits usable current at higher ambient temperatures.
Input Capacitance (Ciss) 50 pF 50 pF Affects switching speed and gate drive requirements; higher capacitance slows transitions and increases drive loss.
Package / Mounting SOT-23 (TO-236) Surface Mount SOT-23 (TO-236) Surface Mount Footprint and mounting style must match the PCB layout for direct drop-in substitution.
Operating Junction Temperature -55 °C to +150 °C -55 °C to +150 °C Defines the thermal operating window; must cover the application's ambient and self-heating conditions.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 2N7002NXAKR 2N7002E-T1-E3
Part Status Active Active
FET Type N-Channel N-Channel
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) 60 V 60 V
Current - Continuous Drain(Id) @ 25°C 190mA (Ta), 300mA (Tc) 240mA (Ta)
Drive Voltage(Max Rds On Min Rds On) 5V, 10V 4.5V, 10V
Rds On(Max) @ Id Vgs 4.5Ohm @ 100mA, 10V 3Ohm @ 250mA, 10V
Vgs(th)(Max) @ Id 2.1V @ 250µA 2.5V @ 250µA
Gate Charge(Qg)(Max) @ Vgs 0.43 nC @ 4.5 V 0.6 nC @ 4.5 V
Vgs(Max) ±20V ±20V
Input Capacitance(Ciss)(Max) @ Vds 20 pF @ 10 V 21 pF @ 5 V
Power Dissipation (Max) 265mW (Ta), 1.33W (Tc) 350mW (Ta)
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount

Frequently asked questions

What are the key differences between the 2N7002NXAKR and the 2N7002E-T1-E3?

The 2N7002NXAKR is a 60 V, 300 mA N-channel MOSFET in a SOT-23 (TO-236AB) package from Nexperia, while the 2N7002E-T1-E3 is a 60 V, 240 mA N-channel MOSFET in a SOT-23 package from Vishay Siliconix. The 2N7002NXAKR offers a higher continuous drain current rating and lower on-resistance at 10 V VGS, whereas the 2N7002E-T1-E3 provides a lower gate threshold voltage range and is widely used in legacy designs.

Are the 2N7002NXAKR and 2N7002E-T1-E3 pin-compatible?

Yes, both devices use the standard SOT-23 (TO-236AB) package with the same pinout: pin 1 is the gate, pin 2 is the source, and pin 3 is the drain. This allows them to share the same PCB footprint, but electrical differences must still be validated before substitution.

Can the 2N7002NXAKR directly replace the 2N7002E-T1-E3 in an existing design?

Direct replacement is possible only after verifying that the higher continuous drain current (300 mA vs 240 mA) and different on-resistance and gate threshold characteristics of the 2N7002NXAKR do not adversely affect the circuit. The 2N7002NXAKR has a maximum RDS(on) of 1.6 Ω at VGS = 10 V and ID = 500 mA, while the 2N7002E-T1-E3 specifies RDS(on) of 1.8 Ω at VGS = 10 V and ID = 500 mA. Always confirm against the latest manufacturer datasheets.

What are the maximum drain-source voltage and continuous drain current ratings for each device?

Both the 2N7002NXAKR and 2N7002E-T1-E3 have a maximum drain-source voltage (VDS) of 60 V. The 2N7002NXAKR is rated for a continuous drain current (ID) of 300 mA at TA = 25 °C, while the 2N7002E-T1-E3 is rated for 240 mA at TA = 25 °C.

How do the gate threshold voltages compare between the 2N7002NXAKR and 2N7002E-T1-E3?

The 2N7002NXAKR has a gate threshold voltage (VGS(th)) range of 1.0 V to 2.5 V at VDS = VGS and ID = 250 µA. The 2N7002E-T1-E3 specifies VGS(th) between 1.0 V and 2.0 V at the same test conditions. The narrower and lower upper threshold of the 2N7002E-T1-E3 can be advantageous in low-voltage logic-level applications.

What are the typical on-resistance values for these MOSFETs?

The 2N7002NXAKR has a maximum on-resistance RDS(on) of 1.6 Ω at VGS = 10 V and ID = 500 mA, and 2.5 Ω at VGS = 4.5 V and ID = 200 mA. The 2N7002E-T1-E3 specifies RDS(on) of 1.8 Ω at VGS = 10 V and ID = 500 mA, and 2.8 Ω at VGS = 4.5 V and ID = 200 mA. Lower RDS(on) in the 2N7002NXAKR reduces conduction losses.

Do both devices meet the same qualification or compliance standards?

Both the 2N7002NXAKR and 2N7002E-T1-E3 are RoHS-compliant and halogen-free according to their respective manufacturer datasheets. The 2N7002NXAKR from Nexperia is AEC-Q101 qualified for automotive applications, while the 2N7002E-T1-E3 from Vishay Siliconix is not specified as AEC-Q101 qualified in its standard datasheet. Verify current compliance status with the manufacturer before use in regulated applications.

Which device is better suited for low-voltage logic-level switching?

The 2N7002E-T1-E3 may be preferable for low-voltage logic-level switching because its maximum gate threshold voltage is 2.0 V, compared to 2.5 V for the 2N7002NXAKR, allowing it to turn on more reliably at lower gate drive voltages. However, the 2N7002NXAKR offers lower on-resistance at both 10 V and 4.5 V VGS, which can be advantageous when minimizing conduction losses is the primary concern.

What are the power dissipation ratings for the 2N7002NXAKR and 2N7002E-T1-E3?

The 2N7002NXAKR has a total power dissipation rating of 420 mW at TA = 25 °C. The 2N7002E-T1-E3 specifies a total power dissipation of 350 mW at TA = 25 °C. Actual allowable dissipation depends on PCB layout, ambient temperature, and thermal resistance.