Part A
5CEFA9F23I7N
Intel
- Lifecycle
- Active
- Stock
- 4366 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Replacement verdict
Compatible functional replacement candidate
The 5CEFA9F23I7N and 5CEFA2F23I7 share the same Intel Cyclone V F23 package, speed grade I7, and industrial temperature range, making them pin-compatible FPGA candidates. However, the 5CEFA9F23I7N offers substantially higher logic density, embedded memory, and DSP resources, so the 5CEFA2F23I7 can only serve as a functional substitute where the reduced resource count is acceptable. Designers must validate logic utilization, memory footprint, and DSP requirements before substituting.
Package Type
High match
Logic Density
Not compatible
Embedded Memory
Not compatible
DSP Resources
Not compatible
Parts at a glance
Part B
5CEFA2F23I7
Intel
- Lifecycle
- Active
- Stock
- 6309 PCS
- Package
- BGA-484
- Series
- Embedded - FPGAs (Field Programmable Gate Array)
Key differences
Rows are prioritized by design impact. Highlighted values require attention during substitution.
Key electrical and mechanical differences between the two devices
| Parameter | 5CEFA9F23I7N | 5CEFA2F23I7 | Why it matters |
|---|---|---|---|
| Logic Elements (LE) | 301000 | 25000 | Logic element count determines the maximum complexity of digital designs the FPGA can implement; a large difference means the two devices are not functionally substitutable for most designs. |
| Total RAM Bits | 14251008 | 1953792 | Embedded memory capacity limits buffering, FIFO depth, and data storage on-chip; the larger device supports significantly more memory-intensive applications. |
| Number of 18x18 Multipliers | 684 | 72 | DSP multiplier blocks determine digital signal processing throughput; the difference affects suitability for arithmetic-heavy workloads like filtering and FFT. |
| Number of I/O Pins | 480 | 480 | I/O count determines how many external signals the FPGA can interface with; identical counts mean similar external connectivity capability. |
| Package / Case | FBGA-484 | FBGA-484 | Package type and pin count must match for board-level compatibility; identical packages allow the same PCB footprint to be reused. |
| Supply Voltage | 1.1 V | 1.1 V | Core supply voltage must be compatible with the board power design; identical values simplify power supply reuse. |
| Operating Temperature Range | -40°C to 100°C | -40°C to 100°C | Industrial temperature range affects deployment in harsh environments; identical ranges mean equivalent thermal robustness. |
| Series | Cyclone V E | Cyclone V E | Same device family ensures toolchain, IP, and configuration compatibility, easing migration between the two parts. |
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Full specification comparison
Use manufacturer datasheets as the final authority.
| Specification | 5CEFA9F23I7N | 5CEFA2F23I7 |
|---|---|---|
| Supplier | - | Intel |
| Series | Cyclone® V E | Cyclone® V E |
| Part Status | Active | Active |
| Number of LABs/CLBs | 113560 | 9434 |
| Number of Logic Elements/Cells | 301000 | 25000 |
| Total RAM Bits | 14251008 | 2002944 |
| Number of I/O | 224 | 224 |
| Voltage - Supply | 1.07V ~ 1.13V | 1.07V ~ 1.13V |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) | -40°C ~ 100°C (TJ) |
Frequently asked questions
What are the key differences between the 5CEFA9F23I7N and the 5CEFA2F23I7?
The primary difference is logic density. The 5CEFA9F23I7N is a Cyclone V E FPGA with 301,000 logic elements (LEs), while the 5CEFA2F23I7 is a Cyclone V E FPGA with 25,000 LEs. Both devices are offered in the same 484-pin FBGA package (F23) and share the same industrial temperature grade (I7).
Are the 5CEFA9F23I7N and 5CEFA2F23I7 pin-to-pin compatible?
Yes. Both devices use the same F23 package, which is a 484-pin FineLine BGA (FBGA) with a 23 mm x 23 mm body size. However, pin-to-pin compatibility does not guarantee functional equivalence; the 5CEFA9F23I7N offers significantly more user I/O and transceiver channels than the 5CEFA2F23I7, so a design migration requires full pinout verification against the respective device pinout files.
Can the 5CEFA2F23I7 be used as a direct drop-in replacement for the 5CEFA9F23I7N?
No. Although both devices share the same package and pin count, the 5CEFA9F23I7N provides 301,000 LEs and 224 user I/O pins, while the 5CEFA2F23I7 provides 25,000 LEs and 224 user I/O pins. The logic capacity, embedded memory, and DSP resources differ substantially, so a direct drop-in replacement is not feasible without redesigning the logic and verifying timing, power, and configuration requirements.
Do both devices support the same configuration schemes?
Yes. Both the 5CEFA9F23I7N and 5CEFA2F23I7 are Cyclone V E FPGAs and support the same configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration voltage and timing parameters may differ due to density-dependent bitstream size, so the configuration file and flash memory size must be adjusted accordingly.
What is the operating temperature range for both the 5CEFA9F23I7N and 5CEFA2F23I7?
Both devices are specified with the I7 speed grade and industrial temperature range, which is typically -40°C to +100°C junction temperature (Tj). Designers should confirm the exact thermal limits from the respective Intel Cyclone V device datasheet, as thermal performance depends on the actual logic utilization and power dissipation of each design.
Which device consumes more power, the 5CEFA9F23I7N or the 5CEFA2F23I7?
The 5CEFA9F23I7N generally consumes more power because it contains a larger logic fabric, more embedded memory blocks, and more DSP blocks than the 5CEFA2F23I7. Static and dynamic power consumption must be estimated using Intel's Early Power Estimator (EPE) or PowerPlay Power Analyzer, as actual power depends on clock frequency, toggle rates, and resource utilization.
Are both devices RoHS compliant and lead-free?
Yes. Both the 5CEFA9F23I7N and 5CEFA2F23I7 are offered in RoHS-compliant, lead-free packages. The "N" suffix on the 5CEFA9F23I7N explicitly indicates lead-free (Pb-free) construction, and the 5CEFA2F23I7 is also available in a lead-free version. Designers should verify the specific ordering code and environmental compliance documentation from Intel or authorized distributors.
Can the same PCB footprint be used for both the 5CEFA9F23I7N and 5CEFA2F23I7?
Yes. Both devices use the F23 package, which is a 484-pin FBGA with a 23 mm x 23 mm body and 1.0 mm ball pitch. The PCB land pattern and solder ball arrangement are identical. However, because the internal logic and I/O assignments differ, the PCB routing and signal integrity must be revalidated if the design is migrated from one device to the other.