5CEFA9F23I7N vs 5CEFA2U19C6N

This in-depth comparison of the 5CEFA9F23I7N and 5CEFA2U19C6N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Not a drop-in replacement

The 5CEFA9F23I7N and 5CEFA2U19C6N are not functionally interchangeable. They differ fundamentally in logic density, package footprint, speed grade, and operating temperature range, making direct substitution infeasible without complete board redesign and revalidation.

Different logic density Different package footprint Different speed grade Different temperature range

Parts at a glance

Part A

5CEFA9F23I7N

Intel

Lifecycle
Active
Stock
4366 PCS
Package
BGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

5CEFA2U19C6N

Intel

Lifecycle
Active
Stock
9429 PCS
Package
FBGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEFA9F23I7N 5CEFA2U19C6N Why it matters
Logic Elements (LE) 301000 25000 Logic element count determines the maximum complexity of digital logic that can be implemented, directly affecting whether one device can substitute for the other in a design.
Total RAM Bits 14251008 1945600 Embedded memory capacity limits the amount of on-chip buffering and data storage available, which is critical for memory-intensive applications.
Number of I/Os 480 224 The number of user I/O pins determines how many external signals the device can interface with, affecting board-level compatibility.
Package / Case FBGA-484 UBGA-484 Package type and footprint must match the PCB layout for physical substitutability; different package styles are not drop-in compatible.
Operating Temperature Range -40°C to +100°C (Industrial) 0°C to +85°C (Commercial) Temperature grade determines the environments in which the device can reliably operate; industrial and commercial grades are not interchangeable in harsh conditions.
Speed Grade 7 (Fastest) 6 (Faster) Speed grade affects maximum operating frequency and timing closure; a slower grade may not meet timing requirements of a design targeting a faster grade.
Supply Voltage 1.1 V Core 1.1 V Core Core supply voltage must match the board power design; identical values indicate power-compatibility between the two devices.
Number of PLLs 8 4 PLL count limits the number of independent clock domains that can be generated, impacting clocking architecture flexibility.
Embedded Multipliers (18x18) 684 132 DSP block count determines digital signal processing throughput, which is essential for arithmetic-intensive applications like filtering and FFT.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEFA9F23I7N 5CEFA2U19C6N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 113560 9434
Number of Logic Elements/Cells 301000 25000
Total RAM Bits 14251008 2002944
Number of I/O 224 224
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 5CEFA9F23I7N and the 5CEFA2U19C6N?

The 5CEFA9F23I7N is a Cyclone V FPGA with 301,000 logic elements, 13,917 Kbits of embedded memory, and 480 18x18 multipliers in a 484-pin FBGA package, rated for industrial temperature range (TJ = -40°C to 100°C). The 5CEFA2U19C6N is a Cyclone V FPGA with 25,000 logic elements, 1,864 Kbits of embedded memory, and 72 18x18 multipliers in a 484-pin UBGA package, rated for commercial temperature range (TJ = 0°C to 85°C). The 5CEFA9F23I7N offers significantly higher logic density, memory, and DSP resources, while the 5CEFA2U19C6N is a lower-density device with a smaller package footprint.

Are the 5CEFA9F23I7N and 5CEFA2U19C6N pin-to-pin compatible?

No. The 5CEFA9F23I7N uses a 484-pin FBGA package (23 mm x 23 mm), while the 5CEFA2U19C6N uses a 484-pin UBGA package (19 mm x 19 mm). Although both have 484 pins, the package dimensions, ball pitch, and PCB land patterns differ, so they are not pin-to-pin compatible and cannot be used as direct drop-in replacements without PCB redesign.

Can the 5CEFA2U19C6N be used as a substitute for the 5CEFA9F23I7N in an existing design?

No, not directly. The 5CEFA2U19C6N has only 25,000 logic elements versus 301,000 in the 5CEFA9F23I7N, and it provides 1,864 Kbits of embedded memory versus 13,917 Kbits. It also has fewer DSP blocks (72 vs 480) and a different package footprint. A design requiring the resources of the 5CEFA9F23I7N cannot be implemented in the 5CEFA2U19C6N without significant redesign and resource reduction.

What are the operating temperature ranges for these two FPGAs?

The 5CEFA9F23I7N is specified for industrial temperature range with a junction temperature (TJ) of -40°C to 100°C. The 5CEFA2U19C6N is specified for commercial temperature range with a junction temperature (TJ) of 0°C to 85°C. The industrial-rated 5CEFA9F23I7N is suitable for harsher environments, while the 5CEFA2U19C6N is intended for commercial applications.

Do both devices belong to the same FPGA family and use the same configuration method?

Yes. Both the 5CEFA9F23I7N and 5CEFA2U19C6N are members of the Intel (formerly Altera) Cyclone V FPGA family. They share the same configuration schemes, including active serial (AS), passive serial (PS), and JTAG configuration, and are supported by the same Quartus Prime development software. However, the specific configuration bitstream is device-dependent and not interchangeable.

What are the typical applications for each device?

The 5CEFA9F23I7N, with its higher logic density, memory, and DSP resources, is typically used in applications such as industrial automation, video processing, motor control, and communication infrastructure. The 5CEFA2U19C6N, with lower density and a smaller package, is typically used in cost-sensitive and space-constrained applications such as consumer electronics, simple control interfaces, and low-power embedded systems.

Are the speed grades of the 5CEFA9F23I7N and 5CEFA2U19C6N the same?

No. The 5CEFA9F23I7N has a speed grade of 7 (indicated by the "7" in the part number), while the 5CEFA2U19C6N has a speed grade of 6 (indicated by the "6" in the part number). In the Cyclone V family, a lower speed grade number generally indicates a faster device. Therefore, the 5CEFA2U19C6N (speed grade 6) is faster in terms of maximum operating frequency than the 5CEFA9F23I7N (speed grade 7), though the 5CEFA9F23I7N offers much higher logic capacity.

What are the supply voltage requirements for these devices?

Both the 5CEFA9F23I7N and 5CEFA2U19C6N are Cyclone V FPGAs and require a core voltage (VCC) of 1.1 V, an auxiliary voltage (VCCAUX) of 2.5 V, and I/O voltages (VCCIO) that depend on the configured I/O standard (e.g., 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V). Specific power supply requirements and sequencing should be verified in the respective device datasheets and pin-out files.