FDG6303N vs FDG6301N

This in-depth comparison of the FDG6303N and FDG6301N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDG6303N

onsemi

Lifecycle
Active
Stock
6717 PCS
Series
Transistors - FETs, MOSFETs - FET, MOSFET Arrays
+BOM RFQ
Part B

FDG6301N

onsemi

Lifecycle
Active
Stock
7191 PCS
Series
Transistors - FETs, MOSFETs - FET, MOSFET Arrays
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification FDG6303N FDG6301N
Part Status Obsolete Obsolete
Base Product Number FDG6303 FDG6301
Technology MOSFET (Metal Oxide) MOSFET (Metal Oxide)
Configuration 2 N-Channel (Dual) 2 N-Channel (Dual)
FET Feature Logic Level Gate Logic Level Gate
Drain to Source Voltage (Vdss) 25V 25V
Current - Continuous Drain (Id) @ 25°C 500mA 220mA
Rds On (Max) @ Id, Vgs 450mOhm @ 500mA, 4.5V 4Ohm @ 220mA, 4.5V
Vgs(th) (Max) @ Id 1.5V @ 250µA 1.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs 2.3nC @ 4.5V 0.4nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds 50pF @ 10V 9.5pF @ 10V
Power - Max 300mW 300mW
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Packaging Cut Tape (CT), Tape & Reel (TR) Cut Tape (CT), Tape & Reel (TR)
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