FDMC86259P vs FDMC86262P

This in-depth comparison of the FDMC86259P and FDMC86262P provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDMC86259P

onsemi

Lifecycle: Active
Stock: 7633 PCS
Series: Transistors - FETs, MOSFETs - Single FETs, MOSFETs

+BOM RFQ

Part B

FDMC86262P

onsemi

Lifecycle: Active
Stock: 3095 PCS
Package: WDFN-8
Series: Transistors - FETs, MOSFETs - Single

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	FDMC86259P	FDMC86262P
Series	PowerTrench®	PowerTrench®
Part Status	Active	Active
Base Product Number	FDMC86259	-
FET Type	P-Channel	P-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	150 V	150 V
Current - Continuous Drain (Id) @ 25°C	3.2A (Ta), 13A (Tc)	-
Drive Voltage (Max Rds On, Min Rds On)	6V, 10V	-
Rds On (Max) @ Id, Vgs	107mOhm @ 3A, 10V	-
Vgs(th) (Max) @ Id	4V @ 250µA	-
Gate Charge (Qg) (Max) @ Vgs	32 nC @ 10 V	-
Vgs (Max)	±25V	-
Input Capacitance (Ciss) (Max) @ Vds	2045 pF @ 75 V	-
Power Dissipation (Max)	2.3W (Ta), 62W (Tc)	2.3W (Ta), 40W (Tc)
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount
Packaging	Cut Tape (CT), Tape & Reel (TR)	-
Current - Continuous Drain(Id) @ 25°C	-	2A (Ta), 8.4A (Tc)
Drive Voltage(Max Rds On Min Rds On)	-	6V, 10V
Rds On(Max) @ Id Vgs	-	307mOhm @ 2A, 10V
Vgs(th)(Max) @ Id	-	4V @ 250µA
Gate Charge(Qg)(Max) @ Vgs	-	13 nC @ 10 V
Vgs(Max)	-	±25V
Input Capacitance(Ciss)(Max) @ Vds	-	885 pF @ 75 V

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