FDMC8030 vs FDMC86259P

This in-depth comparison of the FDMC8030 and FDMC86259P provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

FDMC8030

onsemi

Lifecycle: Active
Stock: 3544 PCS
Series: Transistors - FETs, MOSFETs - FET, MOSFET Arrays

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Part B

FDMC86259P

onsemi

Lifecycle: Active
Stock: 7633 PCS
Series: Transistors - FETs, MOSFETs - Single FETs, MOSFETs

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	FDMC8030	FDMC86259P
Series	PowerTrench®	PowerTrench®
Part Status	Obsolete	Active
Base Product Number	FDMC80	FDMC86259
FET Type	-	P-Channel
Technology	MOSFET (Metal Oxide)	MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss)	40V	150 V
Current - Continuous Drain (Id) @ 25°C	12A	3.2A (Ta), 13A (Tc)
Drive Voltage (Max Rds On, Min Rds On)	-	6V, 10V
Rds On (Max) @ Id, Vgs	10mOhm @ 12A, 10V	107mOhm @ 3A, 10V
Vgs(th) (Max) @ Id	2.8V @ 250µA	4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs	30nC @ 10V	32 nC @ 10 V
Vgs (Max)	-	±25V
Input Capacitance (Ciss) (Max) @ Vds	1975pF @ 20V	2045 pF @ 75 V
Power Dissipation (Max)	-	2.3W (Ta), 62W (Tc)
Operating Temperature	-55°C ~ 150°C (TJ)	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount	Surface Mount
Packaging	Cut Tape (CT), Tape & Reel (TR)	Cut Tape (CT), Tape & Reel (TR)
Configuration	2 N-Channel (Dual)	-
FET Feature	Logic Level Gate	-
Power - Max	800mW	-

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