MC908JL3ECDWE vs MC908GR8CDWER

This in-depth comparison of the MC908JL3ECDWE and MC908GR8CDWER provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC908JL3ECDWE

+BOM

1612 PCS | Freescale Semiconductor
MC908GR8CDWER

+BOM

8557 PCS | NXP USA Inc.
Package SOIC-28 SOIC-28
Description IC MCU 8BIT 4KB FLASH 28SOIC IC MCU 8BIT 7.5KB FLASH 28SOIC
Supplier - NXP USA Inc.
Series HC08 HC08
ProductStatus Active Obsolete
CoreProcessor HC08 HC08
CoreSize 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - SCI, SPI
Peripherals LED, LVD, POR, PWM LVD, POR, PWM
NumberofI/O 23 17
ProgramMemorySize 4KB (4K x 8) 7.5KB (7.5K x 8)
ProgramMemoryType FLASH FLASH
RAMSize 128 x 8 384 x 8
Voltage-Supply(Vcc/Vdd) 2.7V ~ 3.3V 2.7V ~ 5.5V
DataConverters A/D 12x8b A/D 6x8b
OscillatorType External Internal
OperatingTemperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
Comparison Model : MC908JL3ECDWE MC908GR8CDWER

+BOM RFQ