MC908JL3ECDWE vs MC908JK8CDWE

This in-depth comparison of the MC908JL3ECDWE and MC908JK8CDWE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908JL3ECDWE

Freescale Semiconductor

Lifecycle
Active
Stock
1612 PCS
Package
SOIC-28
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908JK8CDWE

NXP USA Inc.

Lifecycle
Active
Stock
6614 PCS
Package
SOIC-20
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908JL3ECDWE MC908JK8CDWE
Supplier - NXP USA Inc.
Series HC08 HC08
Part Status Active Obsolete
Core Processor HC08 HC08
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - SCI
Peripherals LED, LVD, POR, PWM LED, LVD, POR, PWM
Number of I/O 23 15
Program Memory Size 4KB (4K x 8) 8KB (8K x 8)
Program Memory Type FLASH FLASH
RAM Size 128 x 8 256 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.3V 2.7V ~ 5.5V
Data Converters A/D 12x8b A/D 13x8b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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