MC908QY8CDWE vs MC908GR4CDWE

This in-depth comparison of the MC908QY8CDWE and MC908GR4CDWE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MC908QY8CDWE

+BOM

1776 PCS | NXP USA Inc.
MC908GR4CDWE

+BOM

9251 PCS | NXP USA Inc.
Package SOIC-16 SOIC-28
Description IC MCU 8BIT 8KB FLASH 16SOIC IC MCU 8BIT 4KB FLASH 28SOIC
Supplier - NXP USA Inc.
Series HC08 HC08
ProductStatus Not For New Designs Obsolete
CoreProcessor HC08 HC08
CoreSize 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - SCI, SPI
Peripherals LVD, POR, PWM LVD, POR, PWM
NumberofI/O 13 17
ProgramMemorySize 8KB (8K x 8) 4KB (4K x 8)
ProgramMemoryType FLASH FLASH
RAMSize 256 x 8 384 x 8
Voltage-Supply(Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
DataConverters A/D 4x10b A/D 6x8b
OscillatorType External Internal
OperatingTemperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
Comparison Model : MC908QY8CDWE MC908GR4CDWE

+BOM RFQ