MC908QY8CDWE vs MC908GR8ACDWE

This in-depth comparison of the MC908QY8CDWE and MC908GR8ACDWE provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908QY8CDWE

NXP USA Inc.

Lifecycle
Active
Stock
1776 PCS
Package
SOIC-16
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MC908GR8ACDWE

NXP USA Inc.

Lifecycle
Active
Stock
7759 PCS
Package
SOIC-28
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MC908QY8CDWE MC908GR8ACDWE
Supplier - NXP USA Inc.
Series HC08 HC08
Part Status Not For New Designs Obsolete
Core Processor HC08 HC08
Core Size 8-Bit 8-Bit
Speed 8MHz 8MHz
Connectivity - SCI, SPI
Peripherals LVD, POR, PWM LVD, POR, PWM
Number of I/O 13 17
Program Memory Size 8KB (8K x 8) 7.5KB (7.5K x 8)
Program Memory Type FLASH FLASH
RAM Size 256 x 8 384 x 8
Voltage - Supply (Vcc/Vdd) 2.7V ~ 5.5V 2.7V ~ 5.5V
Data Converters A/D 4x10b A/D 6x8b
Oscillator Type External Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
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