MC908QY8CDWE vs MC908JB8JDWER

This in-depth comparison of the MC908QY8CDWE and MC908JB8JDWER provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MC908QY8CDWE

NXP USA Inc.

Lifecycle: Active
Stock: 1776 PCS
Package: SOIC-16
Series: Embedded - Microcontrollers

+BOM RFQ

Part B

MC908JB8JDWER

NXP USA Inc.

Lifecycle: Active
Stock: 6402 PCS
Package: SOIC-20
Series: Embedded - Microcontrollers

+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification	MC908QY8CDWE	MC908JB8JDWER
Supplier	-	NXP USA Inc.
Series	HC08	HC08
Part Status	Not For New Designs	Obsolete
Core Processor	HC08	HC08
Core Size	8-Bit	8-Bit
Speed	8MHz	3MHz
Connectivity	-	USB
Peripherals	LVD, POR, PWM	LVD, POR, PWM
Number of I/O	13	13
Program Memory Size	8KB (8K x 8)	8KB (8K x 8)
Program Memory Type	FLASH	FLASH
RAM Size	256 x 8	256 x 8
Voltage - Supply (Vcc/Vdd)	2.7V ~ 5.5V	4V ~ 5.5V
Oscillator Type	External	Internal
Operating Temperature	-40°C ~ 85°C (TA)	0°C ~ 70°C (TA)
Mounting Type	Surface Mount	Surface Mount
Data Converters	A/D 4x10b	-

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