MCF5208CVM166 vs MCF5272VM66

This in-depth comparison of the MCF5272VM66 and MCF5208CVM166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5272VM66

+BOM

2687 PCS | NXP USA Inc.
MCF5208CVM166

+BOM

1212 PCS | NXP USA Inc.
Package BGA-196 MAPBGA-196
Description IC MCU 32BIT 16KB ROM 196MAPBGA IC MCU 32BIT ROMLESS 196LBGA
Series MCF527x MCF520x
ProductStatus Obsolete Active
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 166.67MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB EBI/EMI, Ethernet, I²C, SPI, UART/USART
Peripherals DMA, WDT DMA, WDT
NumberofI/O 32 50
ProgramMemorySize 16KB (4K x 32) -
ProgramMemoryType ROM ROMless
RAMSize 1K x 32 16K x 8
Voltage-Supply(Vcc/Vdd) 3V ~ 3.6V 1.4V ~ 3.6V
OscillatorType External External
OperatingTemperature 0°C ~ 70°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
Comparison Model : MCF5272VM66 MCF5208CVM166

+BOM RFQ