MCF5208CVM166 vs MCF5274VM166

This in-depth comparison of the MCF5208CVM166 and MCF5274VM166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5208CVM166

+BOM

1212 PCS | NXP USA Inc.
MCF5274VM166

+BOM

3588 PCS | NXP USA Inc.
Package MAPBGA-196 256-LBGA
Description IC MCU 32BIT ROMLESS 196LBGA IC MCU 32BIT ROMLESS 256MAPBGA
Supplier - NXP USA Inc.
Series MCF520x MCF527x
ProductStatus Active Not For New Designs
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 166.67MHz 166MHz
Connectivity EBI/EMI, Ethernet, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, WDT DMA, WDT
NumberofI/O 50 69
ProgramMemoryType ROMless ROMless
RAMSize 16K x 8 64K x 8
Voltage-Supply(Vcc/Vdd) 1.4V ~ 3.6V 1.4V ~ 1.6V
OscillatorType External External
OperatingTemperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
MountingType Surface Mount Surface Mount
Comparison Model : MCF5208CVM166 MCF5274VM166

+BOM RFQ