MCF5213CAF66 vs MCF52232AF50

This in-depth comparison of the MCF5213CAF66 and MCF52232AF50 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5213CAF66

+BOM

1356 PCS | NXP USA Inc.
MCF52232AF50

+BOM

891 PCS | NXP USA Inc.
Package LQFP-100 LQFP-80
Description IC MCU 32BIT 256KB FLASH 100LQFP IC MCU 32BIT 128KB FLASH 80LQFP
Supplier - Flip Electronics,NXP USA Inc.
Series MCF521x MCF5223x
ProductStatus Not For New Designs Active
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 50MHz
Connectivity CANbus, I²C, SPI, UART/USART Ethernet, I²C, SPI, UART/USART
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
NumberofI/O 55 56
ProgramMemorySize 256KB (256K x 8) 128KB (128K x 8)
ProgramMemoryType FLASH FLASH
RAMSize 32K x 8 32K x 8
Voltage-Supply(Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
DataConverters A/D 8x12b A/D 8x12b
OscillatorType Internal Internal
OperatingTemperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
MountingType Surface Mount Surface Mount
Comparison Model : MCF5213CAF66 MCF52232AF50

+BOM RFQ