MCF5216CVM66 vs MCF5272VF66J

This in-depth comparison of the MCF5216CVM66 and MCF5272VF66J provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

ISO9001 Quality Control ISO45001 ISO14001 100% Genuine
Part A

MCF5216CVM66

NXP USA Inc.

Lifecycle
Active
Stock
2628 PCS
Package
BGA-256
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5272VF66J

Freescale Semiconductor

Lifecycle
Active
Stock
8019 PCS
Package
LBGA-196
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5216CVM66 MCF5272VF66J
Supplier - Rochester Electronics, LLC
Series MCF521x MCF527x
Part Status Not For New Designs Obsolete
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 66MHz
Connectivity CANbus, EBI/EMI, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
Number of I/O 142 32
Program Memory Size 512KB (512K x 8) 16KB (4K x 32)
Program Memory Type FLASH ROM
RAM Size 64K x 8 1K x 32
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V 3V ~ 3.6V
Oscillator Type Internal External
Operating Temperature -40°C ~ 85°C (TA) 0°C ~ 70°C (TA)
Mounting Type Surface Mount Surface Mount
Data Converters A/D 8x12b -
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