MCF5216CVM66 vs MCF5275CVM166

This in-depth comparison of the MCF5216CVM66 and MCF5275CVM166 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCF5216CVM66

+BOM

2628 PCS | NXP USA Inc.
MCF5275CVM166

+BOM

5018 PCS | Freescale Semiconductor
Package BGA-256 LBGA-256
Description IC MCU 32B 512KB FLASH 256MAPBGA IC MCU 32BIT ROMLESS 256MAPBGA
Supplier - Rochester Electronics, LLC
ProductStatus Not For New Designs Active
CoreProcessor Coldfire V2 Coldfire V2
CoreSize 32-Bit Single-Core 32-Bit Single-Core
Speed 66MHz 166MHz
Connectivity CANbus, EBI/EMI, I²C, SPI, UART/USART EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals DMA, LVD, POR, PWM, WDT DMA, WDT
NumberofI/O 142 69
ProgramMemoryType FLASH ROMless
RAMSize 64K x 8 64K x 8
Voltage-Supply(Vcc/Vdd) 2.7V ~ 3.6V 1.4V ~ 1.6V
OscillatorType Internal External
OperatingTemperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
MountingType Surface Mount Surface Mount
Series MCF521x -
ProgramMemorySize 512KB (512K x 8) -
DataConverters A/D 8x12b -
Comparison Model : MCF5216CVM66 MCF5275CVM166

+BOM RFQ