MCF52235CAL60 vs MCF52259CAG80

This in-depth comparison of the MCF52235CAL60 and MCF52259CAG80 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF52235CAL60

NXP USA Inc.

Lifecycle
Active
Stock
7073 PCS
Package
LQFP-112
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF52259CAG80

Freescale Semiconductor

Lifecycle
Active
Stock
2381 PCS
Package
LQFP-144
Series
Embedded - Microcontrollers
+BOM RFQ

Need help validating a replacement?

Send your BOM and application constraints for technical and sourcing review.

RFQ Contact technical support

Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF52235CAL60 MCF52259CAG80
Series MCF5223x MCF5225x
Part Status Active Active
Core Processor Coldfire V2 Coldfire V2
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 60MHz 80MHz
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals DMA, LVD, POR, PWM, WDT DMA, LVD, POR, PWM, WDT
Number of I/O 73 96
Program Memory Size 256KB (256K x 8) 512KB (512K x 8)
Program Memory Type FLASH FLASH
RAM Size 32K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V 3V ~ 3.6V
Data Converters A/D 8x12b A/D 8x12b
Oscillator Type Internal Internal
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Compare RFQ