MCF5474VR266 vs MCF54455VR266

This in-depth comparison of the MCF5474VR266 and MCF54455VR266 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5474VR266

Flip Electronics

Lifecycle
Active
Stock
3474 PCS
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF54455VR266

NXP USA Inc.

Lifecycle
Active
Stock
3597 PCS
Package
BBGA-360
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5474VR266 MCF54455VR266
Supplier - Flip Electronics,NXP USA Inc.
Series - MCF5445x
Part Status Active Obsolete
Core Processor - Coldfire V4
Core Size - 32-Bit Single-Core
Speed - 266MHz
Connectivity - I²C, SPI, SSI, UART/USART, USB OTG
Peripherals - DMA, WDT
Number of I/O - 132
Program Memory Type - ROMless
RAM Size - 32K x 8
Voltage - Supply (Vcc/Vdd) - 1.35V ~ 3.6V
Oscillator Type - Internal
Operating Temperature - 0°C ~ 70°C (TA)
Mounting Type - Surface Mount
Packaging Tray -
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