MCF5474VR266 vs MCF5471VR200

This in-depth comparison of the MCF5474VR266 and MCF5471VR200 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MCF5474VR266

Flip Electronics

Lifecycle
Active
Stock
3474 PCS
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MCF5471VR200

NXP USA Inc.

Lifecycle
Active
Stock
3644 PCS
Package
BBGA-388
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MCF5474VR266 MCF5471VR200
Supplier - NXP USA Inc.
Series - MCF547x
Part Status Active Not For New Designs
Core Processor - Coldfire V4E
Core Size - 32-Bit Single-Core
Speed - 200MHz
Connectivity - EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
Peripherals - DMA, PWM, WDT
Number of I/O - 99
Program Memory Type - ROMless
RAM Size - 32K x 8
Voltage - Supply (Vcc/Vdd) - 1.43V ~ 1.58V
Oscillator Type - External
Operating Temperature - 0°C ~ 70°C (TA)
Mounting Type - Surface Mount
Packaging Tray -
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