MCIMX6Y2DVM05AB vs MCIMX503CVM8BR2

This in-depth comparison of the MCIMX6Y2DVM05AB and MCIMX503CVM8BR2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX6Y2DVM05AB

+BOM

7488 PCS | NXP USA Inc.
MCIMX503CVM8BR2

+BOM

2082 PCS | NXP USA Inc.
Package MAPBGA-289 400-LFBGA
Description I.MX6ULL ROM PERF ENHAN IC MPU I.MX50 800MHZ 400MAPBGA
Supplier - NXP USA Inc.
Series i.MX6 i.MX50
ProductStatus Active Obsolete
CoreProcessor ARM® Cortex®-A7 ARM® Cortex®-A8
NumberofCores/BusWidth 1 Core, 32-Bit 1 Core, 32-Bit
Speed 528MHz 800MHz
Co-Processors/DSP Multimedia; NEON™ MPE Multimedia; NEON™ SIMD
RAMControllers LPDDR2, DDR3, DDR3L LPDDR, LPDDR2, DDR2
GraphicsAcceleration No Yes
Display&InterfaceControllers Electrophoretic, LCD LCD
Ethernet 10/100Mbps (2) 10/100Mbps (1)
USB USB 2.0 OTG + PHY (2) USB 2.0 + PHY (2)
Voltage-I/O 1.8V, 2.8V, 3.3V 1.2V, 1.875V, 2.775V, 3.0V
OperatingTemperature 0°C ~ 95°C (TJ) 0°C ~ 70°C (TA)
SecurityFeatures A-HAB, ARM TZ, CSU, SJC, SNVS Boot Security, Cryptography, Secure JTAG
Comparison Model : MCIMX6Y2DVM05AB MCIMX503CVM8BR2

+BOM RFQ