MCIMX6Y2DVM05AB vs MCIMX535DVV1C

This in-depth comparison of the MCIMX535DVV1C and MCIMX6Y2DVM05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX535DVV1C

+BOM

6636 PCS | NXP USA Inc.
MCIMX6Y2DVM05AB

+BOM

7488 PCS | NXP USA Inc.
Package TEPBGA-2 MAPBGA-289
Description IC MPU I.MX53 1.0GHZ 529TEBGA-2 I.MX6ULL ROM PERF ENHAN
Series i.MX53 i.MX6
ProductStatus Obsolete Active
CoreProcessor ARM® Cortex®-A8 ARM® Cortex®-A7
NumberofCores/BusWidth 1 Core, 32-Bit 1 Core, 32-Bit
Speed 1.0GHz 528MHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ MPE
RAMControllers LPDDR2, DDR2, DDR3 LPDDR2, DDR3, DDR3L
GraphicsAcceleration Yes No
Display&InterfaceControllers Keypad, LCD Electrophoretic, LCD
Ethernet 10/100Mbps (1) 10/100Mbps (2)
SATA SATA 1.5Gbps (1) -
USB USB 2.0 (2), USB 2.0 + PHY (2) USB 2.0 OTG + PHY (2)
Voltage-I/O 1.3V, 1.8V, 2.775V, 3.3V 1.8V, 2.8V, 3.3V
OperatingTemperature -20°C ~ 85°C (TC) 0°C ~ 95°C (TJ)
SecurityFeatures ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection A-HAB, ARM TZ, CSU, SJC, SNVS
Comparison Model : MCIMX535DVV1C MCIMX6Y2DVM05AB

+BOM RFQ