MCIMX6Y2DVM05AB vs MCIMX6S5DVM10AD

This in-depth comparison of the MCIMX6S5DVM10AD and MCIMX6Y2DVM05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX6S5DVM10AD

+BOM

2839 PCS | NXP USA Inc.
MCIMX6Y2DVM05AB

+BOM

7488 PCS | NXP USA Inc.
Package MAPBGA-624 MAPBGA-289
Description II.MX 6S ROM PERF ENHAN I.MX6ULL ROM PERF ENHAN
Series i.MX6S i.MX6
ProductStatus Active Active
CoreProcessor ARM® Cortex®-A9 ARM® Cortex®-A7
NumberofCores/BusWidth 1 Core, 32-Bit 1 Core, 32-Bit
Speed 1.0GHz 528MHz
Co-Processors/DSP Multimedia; NEON™ SIMD Multimedia; NEON™ MPE
RAMControllers LPDDR2, LVDDR3, DDR3 LPDDR2, DDR3, DDR3L
GraphicsAcceleration Yes No
Display&InterfaceControllers Keypad, LCD Electrophoretic, LCD
Ethernet 10/100/1000Mbps (1) 10/100Mbps (2)
USB USB 2.0 + PHY (4) USB 2.0 OTG + PHY (2)
Voltage-I/O 1.8V, 2.5V, 2.8V, 3.3V 1.8V, 2.8V, 3.3V
OperatingTemperature 0°C ~ 95°C (TJ) 0°C ~ 95°C (TJ)
SecurityFeatures ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection A-HAB, ARM TZ, CSU, SJC, SNVS
Comparison Model : MCIMX6S5DVM10AD MCIMX6Y2DVM05AB

+BOM RFQ