MCIMX6Y2DVM05AB vs MCIMX7D3DVK10SD

This in-depth comparison of the MCIMX7D3DVK10SD and MCIMX6Y2DVM05AB provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MCIMX7D3DVK10SD

+BOM

4877 PCS | NXP USA Inc.
MCIMX6Y2DVM05AB

+BOM

7488 PCS | NXP USA Inc.
Package MAPBGA-488 MAPBGA-289
Description I.MX 7DUAL: REV 1.3 I.MX6ULL ROM PERF ENHAN
Series i.MX7D i.MX6
ProductStatus Active Active
CoreProcessor ARM® Cortex®-A7, ARM® Cortex®-M4 ARM® Cortex®-A7
NumberofCores/BusWidth 2 Core, 32-Bit 1 Core, 32-Bit
Speed 1.0GHz 528MHz
Co-Processors/DSP Multimedia; NEON™ MPE Multimedia; NEON™ MPE
RAMControllers LPDDR2, LPDDR3, DDR3, DDR3L LPDDR2, DDR3, DDR3L
GraphicsAcceleration No No
Display&InterfaceControllers Keypad, LCD, MIPI Electrophoretic, LCD
Ethernet 10/100/1000Mbps (2) 10/100Mbps (2)
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) USB 2.0 OTG + PHY (2)
Voltage-I/O 1.8V, 3.3V 1.8V, 2.8V, 3.3V
OperatingTemperature 0°C ~ 95°C (TJ) 0°C ~ 95°C (TJ)
SecurityFeatures A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS A-HAB, ARM TZ, CSU, SJC, SNVS
Comparison Model : MCIMX7D3DVK10SD MCIMX6Y2DVM05AB

+BOM RFQ